Pololu 830-Point Breadboard

A full-size solderless breadboard with 830 tie points for building prototype circuits without soldering. 63 rows of pins plus four bus lines running the length of the board, with rows and columns labelled for easy tracking. Fits up to nine 14-pin DIP ICs and accepts most through-hole components and wire up to 22 AWG. Adhesive backing for mounting, and multiple boards interlock for larger builds.

• 830 tie points
• 63 rows plus 4 power/ground bus lines
• Dimensions: 6.5 × 2.125 in
• Holds up to nine 14-pin DIP ICs
• Accepts wire up to 22 AWG
• Adhesive backing, interlockable
• Pololu item #352